IEEE VCIP 2018: Call for special session papers


3D Big Data: Representation, Understanding and Applications

With the rapid advancement of networks, graphics hardware, and computing techniques, the 3D information has been widely applied in various domains,such as virtual reality, 3D graphics, medical industry, and architecture design. The proliferation of such applications has produced explosively growing 3D multimedia data, which leads to the requirement for large-scale 3D data analysis. The traditional 3D feature representation and learning algorithms may not work well for large-scale analysis, such as 3D retrieval and recognition, since the computational cost in such cases is much larger. How to design efficient and effective 3D feature representation and learning techniques to deal with big data is desirable and meaningful. In recent years, the view-based 3D analysis has attracted broad research interest, due to its exibility in representing 3D objects by multiple views, without the requirement for the complex 3D model information.
      Although promising results have been achieved by existing view-based paradigm, there still remain some important problems unsolved. For example, how to well employ the popular deep learning methods into 3D analysis is still not clear, extracting discriminative 3D features is also not well investigated, and how to perform 3D hashing for efficient retrieval is also an open session. This special session will focus on the most recent progress on large-scale 3D multimedia analysis and applications, such as 3D representation, retrieval, recognition, classification, detection, and tracking, etc. The primary objective of this special session fosters focused attention on the latest research progress in this interesting area.
      This special session seeks for original contributions reporting the most recent progress on 3D multimedia analysis and applications. It targets a mixed audience of researchers and product developers from several commu-nities, i.e., computer vision, multimedia, machine learning, etc. The topics of interest include, but are not limited to:
  • 3D big data management 
    • 3D data acquisition and benchmarking
    • 3D feature extraction
    • 3D feature dimension reduction
    • Multi-view registration and calibration
    • 3D data visualization
    • 3D quality assessment metrics and methodology
  • 3D big data understanding 
    • View-based 3D analysis
    • Big data indexing and hashing
    • 3D information retrieval and recognition
    • 3D analysis on mobile devices
    • 3D detection for autonomous driving
    • Point cloud for 3D analysis
  • 3D big data applications 
    • Medical applications, such as telemedicine
    • Industrial design, such as computer-aided manufacturing
    • Virtual reality, such as human-computer interaction and 3D big data synthesis
    • 3D analysis on mobile devices
  • Learning methods for 3D big data 
    • Weakly-supervised/unsupervised learning
    • Few/one/zero shot learning
    • Deep learning and reinforcement learning
    • Metric learning
    • Multi-modal/multi-task learning
Important Dates
  • Submission deadline: May 25, 2018
  • Notification of acceptance: August 24, 2018
  • Conference date: December 9-12, 2018
Paper Submission
Authors should prepare their manuscript according to the Guide for Authors of IEEE VCIP available at Author Guidelines and submit their papers at the submission page. All the papers will be peer-reviewed following the IEEE VCIP reviewing procedures.

Organizers